| We provide consulting services on process flow designs and fabrication tasks. We etch silicon by either wet etching or dry etching. For wet etching, either KOH or TMAH can be used to etch silicon. The etching mask can be Silicon Nitride or Silicon Dioxide. For dry etching, Deep Reactive Ion Etching (DRIE) etches silicon anisotropically. In either way, the etching depth can be nanometer or all the way through the wafer. |