| We provide consulting services on process flow designs and fabrication tasks. We bond silicon wafer to glass wafer by anodic bonding. The substrates are clamped between two electrodes and heated up to about 400 Celsius degree. Then hundreds DC potential is applied between two electrodes and penetrates the substrates. This causes the depletion of sodium ions on glass surface and makes it highly reactive with the silicon surface. And a solid chemical bond forms. |